Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States
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product
Hybrid Socket
CSP/Ballnest
Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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product
Quick-Release Universal ZIF
Series X57X
Quick-Release Universal Zero Insertion Force Dip Test Socket. Aries Universal Test Socket accepts devices on .300 to .600 [7.62 to 15.24] centers. Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads.
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product
PLCC-to-DIP Adaptor
Series 352000/353000
PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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product
Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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product
DIP Jumpers
Series 100 thru 111
DIP Jumpers. Aries offers a wide array of DIP jumper configurations and wiring possibilities for all your programming needs. Protective covers are ultrasonically welded on and provide strain relief for cables. 10-color cable allows for easy identification and tracing.
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product
PLCC-to-PGA JEDEC Type 0.050 [1.27] Pitch Adaptor
Series 505
PLCC to PGA Adapter for JEDEC Type .050 [1.27] Pitch Devices.
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product
24-Pin SOIC w/Package-to-22-Pin 0.400" DIP
22-304504-18
24Pin SOIC w/ Package to 22 Pin .4 DIP. A cost effective means of upgrading to SOIC without changing your PCB layout.
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product
Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
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product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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product
PLCC-to-DIP Adaptor
Series 652000/653000
PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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product
40-Pin DIP-to-Socketable PLCC Adaptor
1111163
40 Pin DIP to Socketable PLCC Adapter. Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. Allows user to switch package styles and avoid shortage problems. Designed to plug directly into your 44 pin PLCC socket.
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product
160-Position QFP-to-PGA Adapter
96-160M65
QFP to PGA Adapter for 160 Position, .0256 [.65] Pitch. Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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product
n-Line Jumpers on 0.100 [2.54] Centers
Series 152, 156 & 157
In-Line Jumpers on .100 [2.54] Centers. End connectors have Gold plated, solid Brass pins on .100 [2.54] centers. Available single-ended (Series 156), double-ended (Series 157), or bare-ended (Series 152). Reliable, electronically tested solder connections.
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product
Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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product
DIP Adaptor
48Pin .5mm QFP to 48Pin .6 Dip Adapter. Makes 48 pin QFP prototype circuits with a standard bread board easy.
