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product
2.5G Distributed Feedback Lasers
Macom Technology Solutions Holdings Inc.
MACOM’s Distributed Feedback (DFB) laser diodes are designed for direct modulation uncooled operation up to 2.5Gb/s. These products utilize patented Etched Facet Technology (EFT) for exceptional reliability with the following benefits: *Etched Facet Technology enabling high performance and product uniformity*Wide operating temperature range for wireless, PON and datacenter applications*No isolator required due to high back-reflection rejection
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product
10G Distributed Feedback Lasers
Macom Technology Solutions Holdings Inc.
MACOM’s Distributed Feedback (DFB) laser diodes are designed for direct modulation uncooled operation up to10Gb/s. These products utilize patented Etched Facet Technology (EFT) for exceptional reliability with the following benefits: *Etched Facet Technology enabling high performance and product uniformity*Wide operating temperature range for wireless, PON and datacenter applications*No isolator required due to high back-reflection rejection
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product
25G Distributed Feedback Lasers
Macom Technology Solutions Holdings Inc.
MACOM’s Distributed Feedback (DFB) laser diodes are designed for direct modulation uncooled operation up to 25Gb/s. These products utilize patented Etched Facet Technology (EFT) for exceptional reliability with the following benefits: *Etched Facet Technology enabling high performance and product uniformity*Wide operating temperature range for wireless, PON and datacenter applications*No isolator required due to high back-reflection rejection
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product
25G Febry-Perot Lasers
Macom Technology Solutions Holdings Inc.
MACOM’s FP lasers are designed for operation up to 25G, and are targeted at 4G and 5G Fronthaul applications. These products utilize patented Etched Facet Technology (EFT) for exceptional reliability and have the following benefits : *Etched Facet Technology enabling high performance and product uniformity*Industrial temperature operation from -40ºC to 95ºC, ideally suited for 4G and 5G fronthaul applications*Non-hermetic capability suited for low cost or datacenter applications*High back-reflection rejection, enabling low cost packaging without the need for isolators
