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Test Handler
ETH
The ENGMATEC test handler as the "heart" of our inline test solutions impresses with its wide range of applications for in-circuit, functional or final tests. All components of the modular system are coordinated with one another and can be combined with one another and with various production systems. Vision systems, scanners, marking devices and many other functions can be integrated.
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ATOM Handler
The ATOM-IC Handler is a benchtop handler designed for use on engineering test floors and in development operations. Its innovative design allows for maximum flexibility and minimum cost and maintenance.
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Wafer Probers
Full Automatic Wafer Prober. Semi Automatic Wafer Prober. High Current Probe Block. 6-inch Manual Prober. 8-inch Manual Prober. 12-inch Manual Prober.
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Test Handler
JOT M5
Simple, cost-effective way to automate PCB and pallet based testingSafe, reliable product handlingQuick-adjust ease: no product-specific partsFaster handling of smart productsIndustry 4.0 autonomous interconnectivityTruly scalable for growing test needsReusable, application-specific test boxesM-TestBoxes compatible with M1 handlerBoxes are fully independent, just pull out from M5 rack and use in off-line testingFail product separation to integrated magazineSpacious service-friendly constructionErgonomic workspaceTouchscreen UI with base statistics and service capabilityEasy start-stop operabilityAutomated width adjustment
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Test Handler
M4171
Advantest’s M4171 single-site handler combines these capabilities in a portable design that is ideally suited for use in engineering environments.
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Logic Test Handler
M620
- Maximized Productivity- Handles various device size- Short conversion time- Easy mantenance- Minimized footprint
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Test Handlers
Multitest Elektronische Systeme GmbH
Multitest has more than 30 years of experience in device handling. Our broad portfolio ensures the most efficient solution for your test application including:*leaded and leadless devices*singulated packages and packages in strips*tri-temp test*MEMS test
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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IC Pick & Place Handlers
Chroma's IC test and handler solutions assure that IC packaging meets the original design specifications and verify the performance of the IC before it is assembled into the electronic product.
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Gravity Test Handlers
Extremely small to very large packages, very wide temperature range, high throughput octal site and quad site testing.
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Miniature IC Handler
3270
Chroma 3620 is an innovative system handler for high-volume multi-site IC testing, especially for CIS Testing, at the system level.
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Silicon & Compound Wafers
Compound semiconductors are undergoing a major expansion addressing many new applications and using various materials such as SiC, GaN, GaAs and others, to improve the performance of new devices in several segments such as Power and Face Recognition.
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Test Handler
Test Handler is an equipment that automates the final testing of semiconductor devices. It handles device transportation, controls temperature during semiconductor testing, and sorts devices based on test results.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Tri-Temp Test Handler
JANUS 2800T Tri-Temp Handler
SESSCO Janus 2800T Tri-temp Handler is designed to accommodate small to medium size standard and custom IC packages. Supports high parallelism of up to octal sites and is equipped with dual high-speed input tube loaders and dual auto output tube unloaders for higher throughput up to 28K UPH. With over 500+ I/O and 16 temperature zones available, it has plenty enough resources for the most demanding applications. It can be customized for MEMS applications and high-voltage testing. Powered by a cutting-edge 10 ns/step all-integrated controller and modular programming design.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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High Speed Pick and Place Handler
Commander 2000
At throughput rates in excess of 2000 Units per Hour the HT Commander 2000 system provides unparalleled performance for the production handling and programming of flash memory devices or modules.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Test Handler
M4841
High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
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Universal Off-Line Handler
OLS Series
Developed as an economical and versatile solution, it adapts to any offline test application - ICT (In Circuit Test), ISP (Flashing) or FCT (functional). The design of this solution allows the quick and ergonomic change of fixtures , with a change time of less than 3 minutes.
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Wafer Manufacturing
Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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High-Speed Laser Mark Handler
MCT MH-3300
MH-3300™ high-speed laser mark handler is used for marking of 2DID codes on the lead frame in support of strip testing, marking of reject devices, and for final package marking in strip test or assembly operations. The MH-3300 offers unparalleled throughput performance and the best cost-of-ownership in the industry.
