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- Pickering Interfaces Inc.
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PXI/PXIe MEMS Optical Switch, Triple Insert/Bypass, Single-Mode, 9/125 Fiber, MU Connectors
42-860A-332
The 40/42-860A-332 is a PXI/PXIe triple insert/bypass switch with MU connectors and is part of Pickering's range of PXI Fiber Optic MEMS Switching modules.
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ROBOT-MOUNTED OPTICAL CMM 3D SCANNERS
METRASCAN-R
Part of the MetraSCAN 3D line-up, the robot-mounted MetraSCAN-R optical CMM 3D scanning systems are fast and accurate scanning solutions designed for 3D automated inspection of parts on the production line and on the shop floor. In combination with industrial robots, the MetraSCAN-R series increases the reliability, speed and versatility of on-line inspection and quality control (QC) process.
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Automated Gage Measurement System
AGMS
Our Automated Gage Measurement System for Sand Screen (AGMS) provides accurate and repeatable optical measurements for all wire-wrapped gaps along the full screenlength. This inspection machine enables oil field sand screen manufacturers to meet the measurement requirements of API Spec 19S1 and ISO 17824:2009.
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Automated Surface Inspection for Glossy Components
Flawlessly glossy surfaces are among the most important quality features of many premium products. The smallest surface defects immediately have a degrading effect on the product. The result: disappointed end customers or buyers. At the same time, reflective surfaces are often very sensitive and a challenge for optical metrology. A manual inspection is tedious, expensive, and ultimately always governed by subjective decision criteria. During production, faulty painting or coating processes can cause high scrap rates. Defects that are not detected even during the final inspection can lead to expensive complaints and, in the worst case, to the loss of the customer. Only an efficient, automated surface inspection achieves the highest quality at acceptable costs.
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THT AOI
Mek THT AOI overcomes these challenges of automated through-hole inspection with a unique combination of mechanical, optical and software design alternatives, unavailable in many conventional systems.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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2-port/4-port PCI Express GigE Frame Grabber Card
AX92320
The AX92320 supports PCI Express x4 lane, two or four independent Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports and GigE Vision camera compliance. The PCI Express x4 frame grabber can provide up to 30 watts at 54 VDC power to port which allows power to be supplied to connected PoE-based devices, such as GigE Vision cameras in machine vision systems. The intelligent GigE Vision card also supports IEEE 1588 (precise time protocol), enabling synchronization with multi-camera acquisition. Combining IEEE 1588 and PoE function, the card utilizes a single Ethernet cable for power, data, and synchronization. Furthermore, it supports jumbo frames up to 9.5KB. The AX92320 is ideal for PoE applications such as automated optical inspection (AOI), factory automation, and PC-based surveillance systems.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Inspection System
Pixie
3-D Metrology for automation. Pixie is a standard system for automated optical quality inspection. Pixie can be configured with 2 to 5 servo driven axis movement and the high-speed measurement capabilities make it suitable for inline and stand-alone solutions.
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Optical 3D Scanner
ATOS Core
ATOS Core is the specialist for the three-dimensional measurement of small components up to 500 millimeters in size. The sensor forms the basis for a diverse range of measuring tasks – from simple 3D scanning to fully automated measurement and inspection processes. The ATOS Core is used for the three-dimensional measurement of small and medium-sized objects such as ceramic cores, and cast or plastic parts. To capture also large objects of several meters in optimal workflows, the ATOS Core can be easily combined with digital photogrammetry of GOM's optical 3D coordinate measuring machine TRITOP.
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Automated Optical Inspection System
AV880 Series
The AV880 Series of AOI solutions from ASC International provides the same high level inspection capabilities as found in our AV862/AV871 Series of AOI systems all wrapped into an inline platform for continuous flow requirements. A price to performance ratio sure to please those looking for a quick ROI.
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Atomic Force Microscope
HDM Series
The task of identifying nanoscale defects is a very time consuming process for engineers working with media and flat substrates. Park NX-HDM is an atomic force microscopy system that speeds up the defect review process by an order of magnitude through automated defect identification, scanning and analysis. Park NX-HDM links directly with a wide range of optical inspection tools, thus significantly increasing the automatic defect review throughput. In addition, Park NX-HDM provides accurate sub-angstrom surface roughness measurements, scan after scan. Park NX-HDM, together with its industry's lowest noise floor, and its unique True Non-Contact™ technology, it is the most accurate AFM for surface roughness measurement in the market.
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(AOI) Automated Optical Inspection Systems
For automated defect detection and high-accuracy measurements. VisionGauge Online High-Speed AOI systems are perfect solutions for demanding high-throughput, high-resolution applications. These systems are perfect for a wide range of applications including MicroElectroMechanical systems (for MEMS inspection or MEMS measurement), semiconductor & discrete device inspection and measurement.
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Automated Optical Inspection System
506
We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Advanced Automated Optical Inspection (AOI)
V510i Optimus 3D
V510 has high productivity, the superior detection capability and inductory fastest inspection speed. It is by High Speed Multi Frequency Phase Shift Profile technology and simultaneous inspection method of 2D/3D. V510 can inspect that without influencing the surface condition and the warp of the board by unique lighting technology.By much algorithm, inspevtion of the component smoothness and the very small component is possible.
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ATOS Triple Scan
In the standardized measuring machine ATOS ScanBox, ATOS Triple Scan is used for fully automated measuring and inspection of parts. The ATOS ScanBox is a complete optical 3D measuring machine that was developed by GOM for an efficient quality control in production and manufacturing processes. In the ATOS ScanBox models of series 5, 6, 7 and 8, ATOS Triple Scan can be extended with a Plus Box photogrammetry add-on. This allows bigger components or multiple parts to be measured simultaneously.
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2D Automated Optical Inspection Systems (2D-AOI)
BF1 Series
Saki’s unique line scanning technology and coaxial overhead lighting enables high-speed accurate inspection.
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Automated Optical Inspection
K Series3D
K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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Automated Optical Inspection System
AOI Series
Perform visual inspections of printed circuit boards (PCB) during manufacturing in which a camera is used to scan the board in extremely fine detail to check for any defects or failures.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools. As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
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Process Improvement Software for SPI & AOI
SIGMA Link
SIGMA Link software suite links altogether solder paste inspection (SPI), automated optical inspection (AOI) and manufacturing execution system (MES). For Smart Factories, SIGMA Link is the essential element to connect inspection machines to Manufacturing Execution System. This real-time interface ensures full traceability and enables interlocking of machines to automate SMT lines while driving yield to new levels.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Signal Integrity Test Products
RoBAT RCI
*TDR & TDT, Measurement Capabilities*Impedance, Skew, Backdrill measurements*Automated Optical Inspection*DC Electrical Test*Now available with 4 heads*24 port (1 port per channel) TDR/TDT unit*Future capabilities – Fully automated VNA test (4 port S-Parameter Measurement)
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Signal Integrity Test Products
S1
*Fixtureless Test Solution*Automated Optical Inspection*DC Electrical test*Tests any backplane – Small, large, simple, complex*Now available with 4 heads
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Automated Semiconductor Wafer Optical Inspection and Metrology
SITEview Software
Microtronic SITEview Software is designed from the end-user operator’s perspective and is easy to use, fully featured, and modular. Applications include visual wafer inspection, OCR sorting, wafer defect review, second optical inspection, image storage and retrieval, laser marking, microscope interface, and GEM/SECS II communication and seamlessly integrates with EAGLEview, MicroINSPECT and MicroSORT.
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2-Phase Stepper Drives Based On EtherCAT Field Bus
Nu-Step DA Series
The ADLINK Nu-Step DA Series is a stepper driver based on the EtherCAT bus featuring a 32-bit ARM processor and advanced variable current and frequency conversion technology. The driver generates less heat and motor vibration for more stable operation. It not only supports the standard EtherCAT specification, but also supports table comparison triggers for automated optical inspection (AOI) and linear comparison triggers for line scanning.
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Compact IPC
Designed to function as the intelligent edge for manufacturing equipment, IPC-seires is an ultra-compact modular system equipped with 2/4 PCIe/PCI slots for integrating diverse add-on cards, such as I/O cards, motion cards, vision cards, and GPU cards to support machine control and vision applications, or provide artificial intelligence for automated optical inspection (AOI) operations.
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Machine Vision Computers
AIIS Series
Advantech AIIS Series are closely aligned with Machine Automation applications such as Automated Optical Inspection (AOI), Wafer Inspection, and alignment inspection which heavily rely on machine vision.
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CMOS Dual USB3 Cameras
CELERA
CELERA CMOS Dual USB3 cameras provides unrivaled speed, extreme flexibility and quick system integration. Its double USB3 interface, ultra-fast acquisition rate, extremely reduced dimensions and rugged design make CELERA cameras suitable far the most demanding applications: automated optical inspection, high performance sorting systems, industrial metrology, microscopy, medical diagnostics and machine vision. CELERA cameras are powered directly by the USB3 bus eliminating the need for external power adapters. USB3 provides the most cost effective and widespread interface, pushing speed performances at the top.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
