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Wafer
thin crystalline material sliced from ingot.
See Also: Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection, Probe Cards
- Scientific Test, Inc.
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Automated Discrete Semiconductor Tester (ATE)
5000E
Same Proven Technology as all 5000 Series Testers. High Speed Single Test Measure. Capable of Testing Multiple and Mixed Devices. 1KV Standard, 2KV Optional. 1NA to 50A Standard, 100A Optional. 0.1NA Resolution. Complete Self Test. Auto-Calibration. RDSON to 0.1MOHM Resolution. Windows Application Software. Optional Scanner. Optional Wafer Mapping. Optional Curve Trace. MOSFET, IGBT, J-FETTriac, SCR, Sidac, Diac, Quadrac, STS, SBS Transistor, Diode, Opto, Zener Regulator, MOV, Relay. UNDER $23,000.00
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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High Resolution Wafer Thickness & Thickness Variation Gauge
MX 10x series
The MX10x series measure thickness and thickness variation on silicon wafers. It has a resolution of 10 nanometers and can be adapted to different thickness ranges within a few seconds.
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Infrared Microscope
DDR200 & DDR300
The McBain DDR200 and DDR300 for 200mm and 300mm wafer defect detection and review are unmatched in value and features in this special application and price category. The systems offer significant and unique advantages for both production and engineering use, and provide an ideal solution when both defect detection and dimensional metrology are required.
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Metrology & Inspection Systems
Our optical and e-beam wafer metrology and inspection products quickly and accurately measure pattern quality before and during high-volume chip manufacturing.
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High Voltage 50 Ω Pulse Generator
TLP-4010C
High Power Pulse Instruments GmbH
*Wafer and package level TLP/VF-TLP/HMM testing*Ultra fast 50 Ω high voltage pulse output with typical 100 ps rise time*Built-in HMM (IEC 61000-4-2) pulse up to ±10 kV*High pulse output current up to ±40 A*High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)*6 programmable pulse rise times: 100 ps to 50 ns*8 programmable pulse widths: 1 ns to 100 ns*Optional pulse width extender increases pulse width up to 1.6 µs in 68 programmable steps*Fast measurement time, typically 0.2 s per pulse including one-point DC measurement between pulses*Efficient software for system control and waveform data management*The software can control automatic probers for fast measurement of complete wafers*High performance and high quality components
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Probe Series
VEGA Series
MPI VEGA Prober series is ready to meet the diverse test and material handling requirements of the Laser Diode (VCSEL, EEL) and optical module markets. MPI VEGA probers are based on a highly flexible and reliable platform, enabling the test of a wide variety of device types (Wafer, Package & Singulated Die) over temperatures with the ability to handle thin/warped wafers. Multiple probing schemes are also supported with the ability to probe small pads with well-controlled needle force.
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Reflection/Transmission Spectrophotometry
FilmTek 3000 PAR-SE
Scientific Computing International
Engineered to meet the needs of any advanced thin film measurement application, excelling at material characterization on both transparent and non-transparent substrates. Combines spectroscopic ellipsometry, DUV multi-angle polarized reflectometry, and transmission measurement with a wide spectral range to meet the most challenging of measurement demands in both R&D and production. Patented parabolic mirror technology allows for a small spot size down to 50µm, ideal for direct measurement of product wafers and patterned films.
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Process & Material Characterization System
TriboLab CMP
Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of waferpolishing processes. Small R&D-scale specialty system for CMP. Reproduces full-scale wafer polishing process conditions without downtime on production equipment. Provides unmatched measurement repeatability and detail. Allows testing on small coupons for substantial cost savings over whole-wafer testing.
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Probe Cards
Direct Dock
Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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Silicon O/C Content Tester
OCT-2000
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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330 System
NSX
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Wet Process Wafer Handling Robot System
GB4S-W
Genmark’s “wet” process wafer handling robot, the GB4S-W Robot System, offers precision, performance, and reliability. The GB4S-W assures optimal performance and maximum up time of wet process equipment with minimal footprint. The GB4S-W addresses all major concerns such as premature damage of robot’s mechanisms due to moisture/humidity operational conditions associated with wet process applications including CMP and other applications.
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Photonics Test Solutions
Chroma offers precision instruments such as laser drivers, photodetector monitoring, and temperature controllers. These lab class instruments are often intefrated into production solutions for wafer probe test, burn-in and device or module characterization with inspection, metrology, robotics, Industry 4.0 and more.
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Test Service Offerings
ASE Industrial Holding Co., Ltd.
ASE provides a complete range of semiconductor testing services to our customers, including front-end engineering testing, wafer probing, final testing of logic, mixed signal, and memory semiconductors, and other test-related services. Our testing services employ technology and expertise that are among the most advanced in the semiconductor industry.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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LED Type Wafer Alignment Sensor Controller
HD-T1
Panasonic Industrial Devices Sales Company of America
The HD-T1 Series is a new Wafer Alignment Sensor that uses a safe red LED light beam, with a resolution of 30µm, to achieve the same high level performance as Laser Sensors. The HD-T1 Sensor is best suited to detect wafer eccentricity, notches and orientation flats. Using linear image Sensor methodology and high-speed sampling technology, a wide variety of objects can now be stably measured with great precision at ultra-high speeds. This CCD style Sensor is developed for use in almost all fields of industry, e.g. tire manufacturing or Semiconductor production (Wafer Printed Circuit Boards).
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Thermal Engineering Projects
Precision Development Consulting Inc
Open loop temperature controller, LED process tool, Single wafer CVD chamber, Batch CVD Tool, Batch ALD Tool, MOCVD equipment, Device cooler
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BT Imagine New wafer Thickness System
IS-T1
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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Non-contact Measurement Wafer Sorting System (Belt Drive Tranceportation)
NC-6800
*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Number of cassette station can be changed by customers request*Eddy current method for resistivity, Electric capacitance method for wafer thickness*Temperature correction for silicon wafer function
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Hi-Speed Discrete Test System
QT-6000
QT-6000 Test System, with built-in capacitance test (DC+CAP) and Scanbox etc, is applicable to devices like medium & small power transistors, MOS-FET, diodes and Wafer.
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Non-contact Measurement Wafer Sorting System (Robot Hand Tranceportation)
NC-3000R
*High accuracy measurement system for large diameter wafer*Non-contact measurement of resistivity, thickness and conductivity (P/N)*Compact design of Two-stage by measuring area and transfer area*Number of cassette station can be changed by customers request Option : Add wafer flattness measurement system(FLA-200)
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Saw Mark Tester
SRT-301
SRT-301 Saw Mark Tester is used to Measure Line-mark depth of the wafer surface,it has the advantages such. As easy carried, Conveniently operated Liquid crystal display, energy conservation and so on, At the same time,it has the built-in printer and rechargeable batteries , All design are up to the standards of JIS,DIN,ISO,ANSI.
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Semiconductor
Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
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Ultra-Low Frequency Workstation
MK52 Series
Providing Ultra-Low Frequency levels, the MK52 Series offers the ultimate low natural frequency performance for a wide range of high resolution instruments, such as analytical balances, cell injection, confocal microscopes, patch clamping, optical microscopes, wafer probing, sensor calibration, atomic force microscopes and other sensitive equipment requiring high isolation efficiency.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
